A possible assembly scheme?
Hybrids are glued to Aluminum support plate. Alignment is done by aligning the mounting holes in hybrid and Al plate or via reference marks
Chips are glue and bonded; hybrid is tested
Sensor is glued to the hybrid:
- hybrid is positioned with pins in the mounting holes on a base-board
- The sensor is supported on the baseboard (via vacuum) and aligned by two micrometer screws
- Sensor is removed from base board; conductive and non-conductive glue applied to the hybrid edge
- sensor is place in original position